专利名称：Polyimide precursor, polyimide, polyimide
film, polyimide metal laminate, andpolyimide solution
发明人：Yoshiyuki Oishi,Shin-ichiro Kohama,Nobuharu
Hisano
申请号：US14401058申请日：20130514公开号：US09556312B2公开日：20170131
摘要：A polyimide precursor, a polyimide using the polyimide precursor, and apolyimide film using the polyimide. The polyimide film has excellent adhesiveness to ametal layer or an adhesive, and has improved heat resistance. The polyimide solution maybe used as a coating material.
申请人：National University Corporation Iwate University,Ube Industries, Ltd.
地址：Morioka-shi JP,Ube-shi JP
国籍：JP,JP
代理机构：Knobbe Martens Olson & Bear LLP
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