Method and apparatus for measuring thickness of th

专利名称：Method and apparatus for measuring

thickness of thin film formed on substrate

发明人：Motohiro Kono,Yoshiyuki

Nakazawa,Toshikazu Kitajima

申请号：US11069996申请日：20050303

公开号：US20050206911A1公开日：20050922

专利附图：

摘要：A memory () of a control unit () stores correction data () indicating a relationshipbetween a decrement in a measurement value of a film thickness by removal of organic

contamination adsorbed onto a substrate and an amount of adsorbed organiccontamination corresponding to a difference between a true film thickness and themeasurement. The difference is caused by organic contamination adsorbed onto thesubstrate before removal of organic contamination. In a film-thickness measuringapparatus (), a calculating/measuring part obtains a first measurement value of a filmthickness on a substrate () using an ellipsometer (), and further obtains a secondmeasurement value which is affected by remaining organic contamination after organiccontamination adsorbed onto the substrate () is removed by an organic contaminationremover (). A film-thickness calculator () obtains an amount of adsorbed organiccontamination before removal of organic contamination based on the first and secondmeasurement values and the correction data (). A thickness of the thin film formed on thesubstrate () is accurately obtained based on the first measurement value and the amountof adsorbed organic contamination before removal of organic contamination.

申请人：Motohiro Kono,Yoshiyuki Nakazawa,Toshikazu Kitajima

地址：Kyoto JP,Kyoto JP,Kyoto JP

国籍：JP,JP,JP

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