专利名称：Method of manufacturing an electronic
component, especially a Hall sensor
发明人：BAESKOW, WERNER申请号：EP99115284.4申请日：19990802公开号：EP0986111A3公开日：20040102
摘要：A method for producing a electronics component, the electronic components(4), which are arranged in a plastic housing, in particular of a hall sensor. For the time -and cost savings of the manufacturing process, the electronic components are arrangedin a hotmelt adhesive composition and fixed there and then to the design of the housing(8) completely extrusion-coated.
申请人：BERU AG
地址：Mörikestrasse 155 71636 Ludwigsburg DE
国籍：DE
代理机构：WILHELMS, KILIAN & PARTNER Patentanwälte
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