Method for manufacturing an electronic device by r

专利名称：Method for manufacturing an electronic

device by reducing thickness of electronicmembers attached to a carrier

发明人：Edward Fuergut,Joachim Mahler申请号：US13340770申请日：20111230公开号：US08815651B2公开日：20140826

专利附图：

摘要：A method for manufacturing an electronic interconnect device is described, themethod comprising: providing an electronic members each having one or more electrical

contacts on a first member side thereof; providing a carrier having a carrier base andhaving sets of one or more electrically conductive projections on a surface of the carrierbase; attaching the electronic members with the corresponding contacts thereof to therespective set of projections to thereby electrically connect the one or more electricalcontacts of the respective chip with the corresponding one or more electricallyconductive projections of the respective set; encapsulating exposed portions of theelectronic member with an encapsulating material to form an encapsulation.

申请人：Edward Fuergut,Joachim Mahler

地址：Dasing DE,Regensburg DE

国籍：DE,DE

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