专利名称：COMPOSITION FOR ENCAPSULATION
MATERIAL FILM, ENCAPSULATION
MATERIAL FILM, AND ELECTRONIC DEVICECOMPRISING SAME
发明人：SHIM, Jung Sup,CHO, Yoon Gyung,CHANG,
Suk Ky,YOO, Hyun Jee,LEE, Seung Min,BAE,Kyung Yul
申请号：EP14813975.1申请日：20140618公开号：EP3012284A4公开日：20170301
摘要：There are provided a composition for encapsulation film, an encapsulation film,and an electronic device having the same. The present application may provide anencapsulation film having an excellent moisture barrier property, operability, workability,and durability and a structure including an element encapsulated by the encapsulationfilm.
申请人：LG Chem, Ltd.
地址：128 Yeoui-daero Youngdungpo-gu Seoul 07336 KR
国籍：KR
代理机构：Cabinet Plasseraud
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容