专利名称：INTEGRATED CIRCUITS MODELING
MANUFACTURING PROCEDURE ANDMANUFACTURING SYSTEM UTILIZING THESAME
发明人：Hui-Chen Yang申请号：US12579303申请日：20091014
公开号：US20110087359A1公开日：20110414
专利附图：
摘要：An ICs modeling manufacturing procedure is disclosed. A first pattern is printed
on a first surface of a printed circuit board (PCB). The first pattern includes a first barcodeand a plurality of production codes. A plurality of elements are disposed on the firstsurface of the PCB. The PCB is heated to fix the elements on the first surface and securethe first pattern on the first surface of the PCB. When the first pattern is read, a firstproduction information is obtained.
申请人：Hui-Chen Yang
地址：Taoyuan County TW
国籍：TW
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