Sensor device and manufacturing method thereof

专利名称：Sensor device and manufacturing method

thereof

发明人：Toshihiko Takahata,Takashige

Saito,Masahiro Honda,Shinpei Taga,HaruhisaKoike

申请号：US12716436申请日：20100303公开号：US08334158B2公开日：20121218

专利附图：

摘要：In manufacturing a sensor device, a sensor chip having a sensing portion on a

surface thereof is mounted on one surface of a substrate, and a resin having a volatileproperty is arranged on the surface of the sensor chip, thereby covering the surface ofthe sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member.After that, the sealing member is cured, and the resin is heated to be vaporized so that avoid is formed between a covered portion in the surface of the sensor chip, which iscovered by the sealing member, and the sealing member.

申请人：Toshihiko Takahata,Takashige Saito,Masahiro Honda,Shinpei Taga,HaruhisaKoike

地址：Nukata-gun JP,Ama-gun JP,Okazaki JP,Nishio JP,Takahama JP

国籍：JP,JP,JP,JP,JP

代理机构：Posz Law Group, PLC

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