Contact pad

来源：六九路网

专利内容由知识产权出版社提供

专利名称：Contact pad

发明人：Van Mieczkowski,Zoltan Ring,Jason

Gurganus,Helmut Hagleitner

申请号：US12943517申请日：20101110公开号：US09607955B2公开日：20170328

专利附图：

摘要：The present disclosure relates to forming multi-layered contact pads for asemiconductor device, wherein the various layers of the contact pad are formed usingone or more thin-film deposition processes, such as an evaporation process. Each contact

pad includes an adhesion layer, which is formed over the device structure for thesemiconductor device; a titanium nitride (TiN) barrier layer, which is formed over theadhesion layer; and an overlay layer, which is formed over the barrier layer. At least thetitanium nitride (TiN) barrier layer is formed using an evaporation process.

申请人：Van Mieczkowski,Zoltan Ring,Jason Gurganus,Helmut Hagleitner

地址：Apex NC US,Chapel Hill NC US,Raleigh NC US,Zebulon NC US

国籍：US,US,US,US

代理人：Anthony J. Josephson

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